Sony Xperia Z5 with overheating problems. The first batch of SoC Qualcomm Snapdragon 810, the first eight-core processor American semiconductor manufacturer, was affected by overheating problems. A bad package design, a priori, the problem that triggered a sharp decline in performance. The firm responded with a version V2.1 is optimized to avoid the excessive heat and some brands of smartphones opted again for improved chip. Xiaomi and HTC were some of the same to which he recently joined the new Xperia Sony Z5.
Among these models is the Sony Xperia Z5 Premium. The first 4K screen smartphone includes within the mentioned Qualcomm Snapdragon 810 V2.1. However, despite the promises of Qualcomm about having eliminated the problem of overheating, the Japanese manufacturer did not want to take unnecessary risks and less if we value the extra graphics power required to move the Z5 Premium images at 3,840 x 2,160 pixels per inch. Only in this way the passive cooling system including within the motherboard is explained.
Passive cooling system of the Sony Xperia Z5 Premium
This is indicated from Weibo, the Chinese social network in which they hung the photograph of a Sony Xperia Z5 Premium disassembled in which you can see from inside the machine. As detailed, have included a heat pipe with thermal paste to help the processor to better dissipate the heat generated, heat would spread the steel housing of the terminal. Is it effective? As indicated, the team has stoically endured high performance graphic evidence without being resentful gaming experience.
Sony explains overheating Xperia Z3 +
However, you must check whether in fact Sony Xperia and Xperia Z5 Z5 Compact also include the aforementioned cooling system, as indicated in the source. Why do we ask? Precisely because some media as a possible eco PhoneArena overheating problem on the Sony Xperia Z5 are made, at least in the unit under test and which have experienced the same mistake with the Sony Xperia Z3 and Sony Xperia Z4 +.